Along with new CPUs based on the Zen 5 architecture, AMD has announced new boards in June, more precisely new chipsets for them, on which the new boards will be based (the CPUs themselves work in all AM5 boards). The date when these boards will come out seems to be clearer now. But this year, we’ll only see the more expensive X870 and X870E models and it will be a longer wait for the cheaper B850 and B840 variants. Read more “AMD X870, X870E, B850, B840 chipsets: Features and launch dates”
We recently covered the I/O capabilities of Intel’s new processors for laptops and the LGA 1851 desktop platform, due to replace today’s LGA 1700 boards and Alder Lake and Raptor Lake processors in October. However, that was the full features that apply to the more pricy boards based on Z890 chipsets. But Intel will once again resort to segmentation and the cheaper boards will be cut down in various ways, sometimes by quite a bit. Read more “Intel Arrow Lake chipsets: Z890/B860/H810 specs and differences”
In recent days, reports have leaked that AMD’s new generation of processors with Zen 5 will come out in July and August (for laptops), with Intel’s new Arrow Lake and Lunar Lake processors coming out in September. But at Computex 2024, we can expect some previews from companies, and in particular, boards for these CPUs will be on display for the first time. They’ll be coming out for both Arrow Lake and Zen 5, and with new chipsets. Read more “800-series boards from both CPU brands coming, AMD skips 700”
Posts on the Chinese Board Channels forum used to share various information from hardware manufacturer circles, now shed light on future events that await us in the coming year in the desktop market. This concerns both the arrival of a new desktop platform and chiplet processors from Intel, but also AMD. Much less is known about plans for the AM5 platform, so this is an interesting insight if these rumours are confirmed. Read more “New AMD 700 series AM5 chipsets may be coming in Q3 2024”
A week ago, AMD unveiled its most powerful CPUs, the HEDT and workstation Threadripper and Threadripper Pro 7000. Two platforms with WRX90 and TRX50 chipsets were also released with them, but it looks like there could be a third type of boards for these CPUs, with a chipset labelled Pro 695. What it’s supposed to be, however, is very unclear. Or perhaps, on the contrary, seemingly clear but contradictory on closer inspection. Read more “AMD Pro 695 chipset: 2S Threadripper boards, or just a mistake?”
In recent weeks, information about the upcoming AMD A620 chipset and cheaper AM5 boards for Ryzen 7000 CPUs based on it began to appear. One of the hardware “leakers” shared the alleged specifications that the A620 chipset is supposed to have, and also what will be the other features of the boards built on the chipset. According to earlier reports, these could start selling or at least be revealed as early as this month. Read more “A620 chipset specs leak: With PCIe 4.0 but no overclocking”
This week, AMD unveiled the Ryzen 7000 CPUs and Zen 4 architecture at Computex 2022. These new desktop processors will also introduce a brand new platform with the AM5 socket and new chipsets – B650, X670 and X670E. We now have details of these platforms and an overview of the connectivity that the AM5 boards will offer. Some of it has been revealed directly by AMD, but there’s also an unofficial leak with many more details. Read more “AMD AM5 platform: B650, X670, X670E chipsets and how they differ”
The hated fans in the AMD X570 chipset cooler would rather be turned into a proper heatsink by many users. In reality, however, it is not as easy as it may seem. Why don’t manufacturers do it on their own? We tested different speed modes with a fan and compared them with a pure heatsink and also one supplemented by small passive coolers with needles. Read more “AMD X570 cooler: Will 4 heatsinks beat a VRAM fan?”
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