Computex 2026: More innovations you shouldn’t miss

Computex 2026 once again confirmed its status as the most important event in the world of PC hardware. While we could not be physically present at every presentation or visit every booth, many unveiled products at the show are still well worth highlighting. Let’s take a look at the latest innovations from DeepCool, Phanteks, Lian Li, and Thermal Grizzly, all of which showcased new technologies, cooling solutions, and design approaches.

DeepCool—Vapor Chamber Revision

VC 2.0

At Computex 2026, DeepCool demonstrated that it is building the future of its portfolio primarily around a new-generation vapor chamber. VC 2.0 (Vapor Chamber 2.0) became the central theme of most of the company’s new air coolers, with the manufacturer presenting it as a significant step forward in heat transfer efficiency. The technology is gradually being deployed across the entire product range—from low-profile solutions to flagship models designed for the most powerful processors.

ASSASSIN V VISION

The greatest attention was drawn by the new ASSASSIN V VISION. Its predecessor featuring the first-generation vapor chamber, as well as the even older version without it, already delivered very strong performance. DeepCool now combines a second-generation vapor chamber base with eight heatpipes. The top cover, following recent industry trends, incorporates a 4.5-inch LCD display. The manufacturer has also redesigned the cooler to make it more compact and improve memory compatibility.

AN600 VC

VC 2.0 did not appear only in the flagship model. Another interesting product was the AN600 VC, which brings the advantages of this technology into the compact SFF segment. Its low-profile design makes it suitable for Mini-ITX systems. It demonstrates an effort to bring advanced cooling technologies into categories where they have previously been rare.

 

StationX 620

The company also hinted at its ambitions in the professional segment. The new StationX 620 is intended for workstations and represents a response to the growing demands of modern workstation platforms. DeepCool is thus expanding beyond the traditional DIY market and aiming to attract professional system users as well.

G6.3 Dynamic Balancing Standard

In addition to the coolers themselves, DeepCool devoted considerable attention to its fans. The company highlighted its new G6.3 Dynamic Balancing Standard, which focuses on more precise impeller balancing, vibration reduction, and lower noise levels. Although this is not the type of product that immediately attracts visitors at an exhibition, such technological improvements often determine the overall acoustic quality of cooling systems in everyday use.

Phanteks—A New Case Architecture

EX Series Cases

Phanteks introduced an entirely new philosophy of PC case design through its EX series, which seeks to rethink airflow management in modern systems. The foundation of the concept is the separation of individual heat sources into dedicated zones. Instead of the traditional approach, where heat from the processor, graphics card, and power supply mixes within a single space, the EX series uses separate chambers with direct access to fresh air.

EX5

The more affordable branch of the lineup is represented by the EX5, which uses a steel construction while retaining all key elements of the new architecture. The EX5 Plus and EX5 Max add further features to the base concept. The EX5 Plus incorporates integrated liquid cooling with elegantly routed tubing and expanded monitoring functions, while the EX5 Max adds an integrated 6-inch LCD display.

EX6

At the top of the series sits the EX6, which represents a more premium implementation of the concept. The case uses aluminum panels instead of standard steel. It also supports larger components and, in the EX6 Max version (pictured), includes an integrated 10-inch display, a preinstalled liquid cooler, X30 fans, and the NexLinq control system. Phanteks is clearly aiming to provide an almost complete ecosystem in which users receive most premium features already integrated into the case.

X30 Fans

An important part of the presentation was also the previously mentioned X30 fan series, which will serve as the foundation for many upcoming products from the brand. The fans use a unified frame available in 120 mm, 240 mm, and 360 mm configurations, significantly simplifying installation and cable management (though it raises the question of what happens if one fan fails). Another notable feature is their 30 mm thickness, which should provide higher static pressure and improved cooling performance. Phanteks has also opted for aluminum elements, ARGB lighting, and support for both standard and reverse airflow directions.

Lian Li—Airflow, Modularity, and Unconventional Ideas

LANCOOL 207XL

The greatest attention was drawn by the pair of new cases, the LANCOOL 207XL and LANCOOL 4. The 207XL builds on the successful 207 series but in a larger format and with redesigned graphics card cooling. Instead of conventional fans, it uses a system of two bottom-mounted cross-flow fans. These are intended to direct a laminar airflow stream straight toward the GPU.

   

LANCOOL 4

The long-awaited LANCOOL 4 also generated significant interest among visitors. Compared to its first appearance at Expo 2025 (left), it has undergone substantial changes, some of which had already been previewed at last year’s Computex (right).

   

That earlier version was the first to integrate fans directly into the glass front panel. This year’s version continues that evolution with additional refinements. Alongside its unique aesthetics, the case is designed to deliver excellent airflow.

B4-MATX

Another interesting announcement was the B4-MATX, developed in collaboration with the Dan Cases team. The chassis targets users of compact mATX systems and aims to provide high component compatibility without a significant increase in size.

 

GALAHAD III 360

In the cooling segment, the new GALAHAD III 360 AIO system attracted attention. Lian Li adopted an unconventional approach by using shorter tubes primarily intended for top-mounted radiators, aiming to improve cable routing and overall system appearance. The cooler also features a modular pump block with an integrated monitoring display and is expected to be more affordable than some of the company’s premium models.

UNI FAN P28 V2

Fans were also an important part of the exhibit, particularly the UNI FAN P28 V2. The second generation of these performance-oriented fans focuses primarily on high static pressure, reaching up to 7.78 mmH2O while delivering airflow exceeding 187 m³/h (110 CFM).

Maximum rotational speed can be selected from five predefined performance levels ranging from 1,100 RPM to 3,000 RPM. Compared to the first generation, the new model increases both the maximum speed and the number of speed levels, while reducing the gap between blade tips and the fan frame by 0.1 mm (to 0.5 mm). The bearings remain of the FDB type, while the blades, as with the predecessor, are made from LCP.

Thermal Grizzly—From Thermal Pastes and Water Blocks to a Complete Cooling Ecosystem

If just a few years ago Thermal Grizzly was primarily synonymous with thermal pastes, liquid-cooling blocks, and products aimed at extreme overclocking, Computex 2026 demonstrated how much broader the company’s portfolio has become.

DeltaMate P-Series Fans

The DeltaMate P-Series fans are among the most interesting products Thermal Grizzly has introduced to date. Instead of a conventional plastic construction, the manufacturer opted for a CNC-machined aluminum frame, a solution rarely seen in the system fan segment. On the other hand, we have already seen metal used in fan frames, and metal is no longer limited to the frame itself—MSI and Cooler Master have taken similar approaches.

The design philosophy itself is also noteworthy. Thermal Grizzly optimized these fans for lower rotational speeds instead of chasing maximum airflow. The company focused on efficiency and quieter operation. Attention should also be paid to the fan interconnection method. The DeltaMate P-Series uses a USB-based daisy-chain connector system, making it possible to link multiple fans together.

Duronaut Pro and Hydronaut Pro Thermal Pastes

The second major announcement was the introduction of Duronaut Pro and Hydronaut Pro thermal pastes. These new products expand the company’s traditionally strong lineup of TIM (Thermal Interface Material) solutions. Duronaut Pro is presented as a solution focused primarily on long-term stability and high performance suitable even for extreme overclocking.

The new Hydronaut Pro is a silicone-free thermal paste that requires no curing period and is also suitable for industrial applications. Both compounds are, naturally, electrically non-conductive, just like their predecessors.

There was much more to see at the exhibition. Only time will tell which of the showcased solutions gain broader adoption, but we believe the products highlighted above are off to a very promising start.

English translation and edit by Jozef Dudáš