{"id":185987,"date":"2024-02-19T23:59:26","date_gmt":"2024-02-19T22:59:26","guid":{"rendered":"https:\/\/www.hwcooling.net\/?p=185987\/"},"modified":"2024-08-16T02:02:28","modified_gmt":"2024-08-16T00:02:28","slug":"intel-core-i3-14100f-four-cores-whipped-to-the-max-review","status":"publish","type":"post","link":"https:\/\/www.hwcooling.net\/en\/intel-core-i3-14100f-four-cores-whipped-to-the-max-review\/","title":{"rendered":"Intel Core i3-14100F: Four cores whipped to the max"},"content":{"rendered":"

It’s the fastest Core i3 yet, but it’s also the hungriest. The 14100F’s (Raptor Lake Refresh) biggest competition in its own ranks is in the form of older models (13100F<\/a> and 12100F<\/a>). These are a bit slower, but lower-power. The “better” choice depends on what holds more weight on your scales. Maybe it will be that record-breaking speed? In this class (Core i3), power consumption is always relatively low.<\/p>\n

Intel Core i3-14100F in detail<\/h2>\n

The third-generation Core i3 processor for the LGA 1700 platform is built on the smallest Intel big.LITTLE<\/a> chip, physically with six P cores (i.e., stepping H0).<\/p>\n

There are four of them active in this case again and it is an 8-thread processor. It is possible that prospectively it will be the fastest quad-core processor, unless the Ci3-14100F is beaten by Intel within Bartlett Lake<\/a>, where perhaps instead of even more aggressively clocked four cores two will be added, if at all this generation will see the light of day<\/a> (there is still a question mark hanging over it).<\/p>\n

The Core i3 Raptor Lake with 58 W TDP differs from its predecessors with higher clock speeds. Intel increases these by 200 MHz from generation to generation. Compared to the Core i3-13100\/F<\/a> (4300 MHz), it’s already 4500 MHz for all (4) P cores. The PL2 value is 89 W, as is the case with the Core i3-12100\/F<\/a> (Alder Lake), but that doesn’t mean comparable power consumption.The latter is higher with the Core i3-14100\/F, the highest. And quite naturally so, as the manufacturing process hasn’t changed (although some minor “silent” revisions may have occurred over time) and the CPU core clock speeds are increasing.<\/p>\n

\"\"<\/a><\/p>\n

The parameters talk about the power limit, which may not be used to the fullest for some processors and for others goes to the edge, which is also the case with the latest Core i3-14100\/F processors. In the tests, I’ll be looking at the variant with the letter “F” in the designation<\/a>, which, unlike the Core i3-14100<\/a>, has a deactivated graphics core.<\/p>\n

Rather than office PCs (which would require a graphics card to be added, which doesn’t make much sense in most cases), the Core i3-14100F is primarily aimed at low-end gaming PCs. Or to simpler systems for which for some reason the iGPU (Ci3-14100) is not enough and a graphics card is required.<\/p>\n

\"\"<\/a><\/p>\n

In this segment, Intel is somewhat without competition, AMD abandoned the production of low-end processors already in the generation of Ryzen 3000<\/a> (Matisse), where quad-core models Ryzen 3 3100<\/a> and Ryzen 3 3300X<\/a> were only available for a while, at the beginning (at least in Europe, that is).
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<\/div>
<\/th><\/th><\/th><\/th><\/th><\/tr><\/thead>
Manufacturer <\/td><\/td>Intel <\/td>Intel <\/td>Intel <\/td><\/tr>
Line <\/td><\/td>Core i3 <\/td>Core i3 <\/td>Core i3 <\/td><\/tr>
SKU <\/td><\/td>14100F <\/td>13100F <\/td>12100F <\/td><\/tr>
Codename <\/td><\/td>Raptor Lake Refresh <\/td>Raptor Lake <\/td>Alder Lake <\/td><\/tr>
CPU microarchitecture <\/td><\/td>Golden Cove (P) <\/td>Golden Cove (P) <\/td>Golden Cove (P) <\/td><\/tr>
Manufacturing node <\/td><\/td>7 nm <\/td>7 nm <\/td>7 nm <\/td><\/tr>
Socket <\/td><\/td>LGA 1700 <\/td>LGA 1700 <\/td>LGA 1700 <\/td><\/tr>
Launch date <\/td><\/td>01\/08\/2024 <\/td>01\/04\/2023 <\/td>01\/04\/2022 <\/td><\/tr>
Launch price <\/td><\/td>109 USD <\/td>109 USD <\/td>97 USD <\/td><\/tr>
Core count <\/td><\/td>4 <\/td>4 <\/td>4 <\/td><\/tr>
Thread count <\/td><\/td>8 <\/td>8 <\/td>8 <\/td><\/tr>
Base frequency <\/td><\/td>3.5 GHz (P) <\/td>3.4 GHz (P) <\/td>3.3 GHz (P) <\/td><\/tr>
Max. Boost (1 core) <\/td><\/td>4.7 GHz (P) <\/td>4.5 GHz (P) <\/td>4.3 GHz (P) <\/td><\/tr>
Max. boost (all-core) <\/td><\/td>4.5 GHz <\/td>4.3 GHz <\/td>4.1 GHz (P) <\/td><\/tr>
Typ boostu <\/td><\/td>TB 2.0 <\/td>TB 2.0 <\/td>TB 2.0 <\/td><\/tr>
L1i cache <\/td><\/td>32 kB\/core (P) <\/td>32 kB\/core (P) <\/td>32 kB\/core (P) <\/td><\/tr>
L1d cache <\/td><\/td>48 kB\/core (P) <\/td>48 kB\/core (P) <\/td>48 kB\/core (P) <\/td><\/tr>
L2 cache <\/td><\/td>1,25 MB\/core (P) <\/td>1.25 MB\/core (P) <\/td>1.25 MB\/core (P) <\/td><\/tr>
L3 cache <\/td><\/td>1\u00d7 12 MB <\/td>1\u00d7 12 MB <\/td>1\u00d7 12 MB <\/td><\/tr>
TDP <\/td><\/td>58 W <\/td>58 W <\/td>58 W <\/td><\/tr>
Max. power draw during boost <\/td><\/td>89 W (PL2) <\/td>89 W (PL2) <\/td>89 W (PL2) <\/td><\/tr>
Overclocking support <\/td><\/td>No <\/td>No <\/td>No <\/td><\/tr>
Memory (RAM) support <\/td><\/td>DDR5-4800\/DDR4-3200 <\/td>DDR5-4800\/DDR4-3200 <\/td>DDR5-4800\/DDR4-3200 <\/td><\/tr>
Memory channel count <\/td><\/td>2\u00d7 64 bit <\/td>2\u00d7 64 bit <\/td>2\u00d7 64 bit <\/td><\/tr>
RAM bandwidth <\/td><\/td>76.8 GB\/s or 51.2 GB\/s (DDR4) <\/td>76.8 GB\/s or 512 GB\/s (DDR4) <\/td>76.8 GB\/s or 51.2 GB\/s (DDR4) <\/td><\/tr>
ECC RAM support <\/td><\/td>No <\/td>No <\/td>No <\/td><\/tr>
PCI Express support <\/td><\/td>5.0\/4.0 <\/td>5.0\/4.0 <\/td>5.0\/4.0 <\/td><\/tr>
PCI Express lanes <\/td><\/td>\u00d716 (5.0) + \u00d74 (4.0) <\/td>\u00d716 (5.0) + \u00d74 (4.0) <\/td>\u00d716 (5.0) + \u00d74 (4.0) <\/td><\/tr>
Chipset downlink <\/td><\/td>DMI 4.0 \u00d78 <\/td>DMI 4.0 \u00d78 <\/td>DMI 4.0 \u00d78 <\/td><\/tr>
Chipset downlink bandwidth <\/td><\/td>16.0 GB\/s duplex <\/td>16.0 GB\/s duplex <\/td>16.0 GB\/s duplex <\/td><\/tr>
BCLK <\/td><\/td>100 MHz <\/td>100 MHz <\/td>100 MHz <\/td><\/tr>
Die size <\/td><\/td>~160 mm\u00b2 <\/td>~160 mm\u00b2 <\/td>~160 mm\u00b2 <\/td><\/tr>
Transistor count <\/td><\/td>? bn. <\/td>? bn. <\/td>? bn. <\/td><\/tr>
TIM used under IHS <\/td><\/td>Solder <\/td>Solder <\/td>Solder <\/td><\/tr>
Boxed cooler in package <\/td><\/td>Intel Laminar RM1 <\/td>Intel Laminar RM1 <\/td>Intel Laminar RM1 <\/td><\/tr>
Instruction set extensions <\/td><\/td>SSE4.2, AVX2, FMA, SHA, VNNI (256-bit), GNA 3.0, VAES (256-bit), vPro <\/td>SSE4.2, AVX2, FMA, SHA, VNNI (256-bit), GNA 3.0, VAES (256-bit), vPro <\/td>SSE4.2, AVX2, FMA, SHA, VNNI (256-bit), GNA 2.0, VAES (256-bit) <\/td><\/tr>
Virtualization <\/td><\/td>VT-x, VT-d, EPT <\/td>VT-x, VT-d, EPT <\/td>VT-x, VT-d, EPT <\/td><\/tr>
Integrated GPU <\/td><\/td>N\/A <\/td>N\/A <\/td>N\/A <\/td><\/tr>
GPU architecture <\/td><\/td>\u2013 <\/td>\u2013 <\/td>\u2013 <\/td><\/tr>
GPU: shader count <\/td><\/td>\u2013 <\/td>\u2013 <\/td>\u2013 <\/td><\/tr>
GPU: TMU count <\/td><\/td>\u2013 <\/td>\u2013 <\/td>\u2013 <\/td><\/tr>
GPU: ROP count <\/td><\/td>\u2013 <\/td>\u2013 <\/td>\u2013 <\/td><\/tr>
GPU frequency <\/td><\/td>\u2013 <\/td>\u2013 <\/td>\u2013 <\/td><\/tr>
Display outputs <\/td><\/td>\u2013 <\/td>\u2013 <\/td>\u2013 <\/td><\/tr>
Max. resolution <\/td><\/td>\u2013 <\/td>\u2013 <\/td>\u2013 <\/td><\/tr>
HW video encode <\/td><\/td>\u2013 <\/td>\u2013 <\/td>\u2013 <\/td><\/tr>
HW video decode <\/td><\/td>\u2013 <\/td>\u2013 <\/td>\u2013 <\/td><\/tr><\/tbody><\/table><\/div>Wordpress Table Plugin<\/a>
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