{"id":186869,"date":"2024-02-26T07:45:30","date_gmt":"2024-02-26T06:45:30","guid":{"rendered":"https:\/\/www.hwcooling.net\/?p=186869\/"},"modified":"2024-08-06T12:11:22","modified_gmt":"2024-08-06T10:11:22","slug":"the-core-i5-14400f-analysis-is-complete-rare-stepping-c0-tested-review","status":"publish","type":"post","link":"https:\/\/www.hwcooling.net\/en\/the-core-i5-14400f-analysis-is-complete-rare-stepping-c0-tested-review\/","title":{"rendered":"The Core i5-14400F analysis is complete. Rare stepping (C0) tested"},"content":{"rendered":"

For completeness of Intel Core i5-14400F processor tests<\/a> we add the results of its second stepping. We’ve already tested the B0 variant, now it’s time for the C0. Its availability in stores is, at least at the moment, considerably worse and the question arises whether it is worth it at all. Is there any point in aiming for stepping C0 or is B0 also “okay”? Or does it “not matter” (what you get in the shopping lottery)?<\/p>\n

Tests of various steppings in the popular Intel Core i5 1×400(F) processor series are already considered something of a tradition. After the 12400\/F (C0 and H0)<\/a>, 13400\/F (B0 and C0)<\/a> models, there’s the 14400\/F (B0 and C0) to round out the trio.<\/p>\n

Intel Core i5-14400F (C0 vs. B0)<\/h2>\n

At the hardware level, the difference is that while stepping B0 is based on the Raptor Lake generation (produced by the Intel 7 Ultra<\/a> process) and is built on a larger core with physically 8 P and 16 E cores, stepping C0 has a smaller “Alder Lake” silicon chip (Intel 7<\/a>), which has the same number of (8) P cores, but with half the number (8) of E cores.<\/p>\n

The processor stepping can be distinguished from each other at a glance by external features such as the S-Spec code (on the IHS of the processor itself and also listed on the barcode on the package label) or the SMD composition between the contacts on the bottom of the processor. Each of the steppings has this layout done differently, according to the needs of the chip itself.<\/p>\n

\"\"<\/a><\/p>\n

The parameters of both Core i5-14400\/F processor steppings are almost identical, including the size of the L2 cache, which is natively larger (2 MB) in the full Core i5-14400\/F version (stepping B0). For the Core i5-14400\/F, it is always limited to 1.25 MB as per the stepping C0 maximum. From the Raptor Lake Refresh generation, the full 2 MB (L2 cache) is retained only for Core i5 models that have only one stepping \u2013 B0. These are, for example, the 14600<\/a>, the 14600K<\/a>, the 14600KF<\/a> and the 14600T<\/a>.<\/p>\n

A single stepping, but in this case C0, is also present in all Core i5-14500 variants (the K<\/a>, the KF<\/a>, the T<\/a> and also the model without a letter at the end of the designation<\/a>). The combination (of B0 and C0) also occurs with the Core i5 “400” series. The model 14400T<\/a>, as well as the 14490F<\/a>, is always C0, but with the 14400<\/a> and the 14400F<\/a>, you’ll run into both of them (steppings). Although it should be noted that in current practice you rarely do and mostly get to the B0 variant.<\/p>\n

\"\"<\/a>\u00a0 \u00a0\"\"<\/a><\/p>\n

Actually, there is the opposite situation as there was with the Core i5-13400F<\/a>, where there were significantly fewer B0 variants. This could theoretically indicate a larger capacity of C0 wafers, which are already running out. Also, it doesn’t have to be the case, and the significant B0 production is now present, in short, because of the large amount of “waste” from the more powerful models that is being used en masse on the Core i5-14400F. However, this state of affairs may not be permanent and later Intel may revert to older wafers (C0) for the Core i5-14400(F) as well, but who knows. This is just such an internal speculation of ours.<\/p>\n

The reality of today (as of the end of February 2024) is that for the Core i5-14400F model tested, there is a disproportion of C0 variants (there are significantly fewer of them) to B0 variants (the vast majority of production). The new thing compared to the last generation (Core i5-13400F) is that both steppings are sold as a “box” (i.e. with a cooler, retail), the Core i5-13400F stepping B0 is sold only as a “tray”. The order number of the Core i5-14400F (box) in the rarer “C0” form (S-Spec code SRN3R<\/strong>) is BX8071514400F<\/strong> (or CM8071505093011, tray) and for the Core i5-14400F (box) “B0” it\u2019s BX8071514400F<\/strong> (S-Spec code SRN47<\/strong>), for the package without a cooler (tray) primarily intended for OEM builds, it’s CM8071504821113.<\/p>\n

\"\"<\/a><\/p>\n

Please note: <\/strong>Due to the popularity of YouTube tests of multiple samples of the same processor model, some may look down on the results of tests of just one sample. We don’t have more of them when it comes to the C0 stepping. However, based on the fact that the results (both speed and power consumption in Cinebench R23) of the trio of B0 samples have already scaled perfectly (and the same was once true for the Core i5-13400F<\/a>), we can assume that this case will be no different. Authors who point to significant differences generally do not have sufficiently stable conditions to carry out such tests. The presentation of significant differences rather points to a lack of consistency in the test environment, which is defined by an identical application of thermal paste or an identical intake temperature in front of the cooler at all times in addition to an identical cooler down pressure. The latter can typically be achieved by precise installation with a torque screwdriver.<\/div>\n

<\/div>
<\/th><\/th><\/th><\/th><\/tr><\/thead>
Manufacturer <\/td><\/td>Intel <\/td>Intel <\/td><\/tr>
Line <\/td><\/td>Core i5 <\/td>Core i5 <\/td><\/tr>
SKU <\/td><\/td>14400F (C0) <\/td>14400F (B0) <\/td><\/tr>
Codename <\/td><\/td>Raptor Lake Refresh <\/td>Raptor Lake Refresh <\/td><\/tr>
CPU microarchitecture <\/td><\/td>Golden Cove (P) + Gracemont (E) <\/td>Golden Cove (P) + Gracemont (E) <\/td><\/tr>
Manufacturing node <\/td><\/td>7 nm <\/td>7 nm <\/td><\/tr>
Socket <\/td><\/td>LGA 1700 <\/td>LGA 1700 <\/td><\/tr>
Launch date <\/td><\/td>01\/08\/2024 <\/td>01\/08\/2024 <\/td><\/tr>
Launch price <\/td><\/td>196 USD <\/td>196 USD <\/td><\/tr>
Core count <\/td><\/td>6+4 <\/td>6+4 <\/td><\/tr>
Thread count <\/td><\/td>16 <\/td>16 <\/td><\/tr>
Base frequency <\/td><\/td>2.5 GHz (P)\/1.8 GHz (E) <\/td>2.5 GHz (P)\/1.8 GHz (E) <\/td><\/tr>
Max. Boost (1 core) <\/td><\/td>4.7 GHz (P)\/3.5 GHz (E) <\/td>4.7 GHz (P)\/3.5 GHz (E) <\/td><\/tr>
Max. boost (all-core) <\/td><\/td>4.1 GHz <\/td>4.1 GHz <\/td><\/tr>
Typ boostu <\/td><\/td>TB 2.0 <\/td>TB 2.0 <\/td><\/tr>
L1i cache <\/td><\/td>32 kB\/core (P)\/64 kB\/core (E) <\/td>32 kB\/core (P)\/64 kB\/core (E) <\/td><\/tr>
L1d cache <\/td><\/td>48 kB\/core (P)\/32 kB\/core <\/td>48 kB\/core (P)\/32 kB\/core <\/td><\/tr>
L2 cache <\/td><\/td>1,25 MB\/core (P)\/ 2\u00d72 MB\/4 cores (E) <\/td>1,25 MB\/core (P)\/ 2\u00d72 MB\/4 cores (E) <\/td><\/tr>
L3 cache <\/td><\/td>1\u00d7 20 MB <\/td>1\u00d7 20 MB <\/td><\/tr>
TDP <\/td><\/td>65 W <\/td>65 W <\/td><\/tr>
Max. power draw during boost <\/td><\/td>148 W (PL2) <\/td>148 W (PL2) <\/td><\/tr>
Overclocking support <\/td><\/td>No <\/td>No <\/td><\/tr>
Memory (RAM) support <\/td><\/td>DDR5-4800\/DDR4-3200 <\/td>DDR5-4800\/DDR4-3200 <\/td><\/tr>
Memory channel count <\/td><\/td>2\u00d7 64 bit <\/td>2\u00d7 64 bit <\/td><\/tr>
RAM bandwidth <\/td><\/td>76.8 GB\/s\/51,2 GB\/s <\/td>76.8 GB\/s\/51,2 GB\/s <\/td><\/tr>
ECC RAM support <\/td><\/td>No <\/td>No <\/td><\/tr>
PCI Express support <\/td><\/td>5.0\/4.0 <\/td>5.0\/4.0 <\/td><\/tr>
PCI Express lanes <\/td><\/td>\u00d716 (5.0) + \u00d74 (4.0) <\/td>\u00d716 (5.0) + \u00d74 (4.0) <\/td><\/tr>
Chipset downlink <\/td><\/td>DMI 4.0 \u00d78 <\/td>DMI 4.0 \u00d78 <\/td><\/tr>
Chipset downlink bandwidth <\/td><\/td>16.0 GB\/s duplex <\/td>16.0 GB\/s duplex <\/td><\/tr>
BCLK <\/td><\/td>100 MHz <\/td>100 MHz <\/td><\/tr>
Die size <\/td><\/td>~209 mm\u00b2 <\/td>~257 mm\u00b2 <\/td><\/tr>
Transistor count <\/td><\/td>? bn. <\/td>? bn. <\/td><\/tr>
TIM used under IHS <\/td><\/td>Solder <\/td>Solder <\/td><\/tr>
Boxed cooler in package <\/td><\/td>Intel Laminar RM1 <\/td>Intel Laminar RM1 <\/td><\/tr>
Instruction set extensions <\/td><\/td>SSE4.2, AVX2, FMA, SHA, VNNI (256-bit), GNA 3.0, VAES (256-bit), vPro <\/td>SSE4.2, AVX2, FMA, SHA, VNNI (256-bit), GNA 3.0, VAES (256-bit), vPro <\/td><\/tr>
Virtualization <\/td><\/td>VT-x, VT-d, EPT <\/td>VT-x, VT-d, EPT <\/td><\/tr>
Integrated GPU <\/td><\/td>N\/A <\/td>N\/A <\/td><\/tr>
GPU architecture <\/td><\/td>\u2013 <\/td>\u2013 <\/td><\/tr>
GPU: shader count <\/td><\/td>\u2013 <\/td>\u2013 <\/td><\/tr>
GPU: TMU count <\/td><\/td>\u2013 <\/td>\u2013 <\/td><\/tr>
GPU: ROP count <\/td><\/td>\u2013 <\/td>\u2013 <\/td><\/tr>
GPU frequency <\/td><\/td>\u2013 <\/td>\u2013 <\/td><\/tr>
Display outputs <\/td><\/td>\u2013 <\/td>\u2013 <\/td><\/tr>
Max. resolution <\/td><\/td>\u2013 <\/td>\u2013 <\/td><\/tr>
HW video encode <\/td><\/td>\u2013 <\/td>\u2013 <\/td><\/tr>
HW video decode <\/td><\/td>\u2013 <\/td>\u2013 <\/td><\/tr><\/tbody><\/table><\/div>Wordpress Table Plugin<\/a>
\n
\n