{"id":277575,"date":"2026-05-11T18:01:10","date_gmt":"2026-05-11T16:01:10","guid":{"rendered":"https:\/\/www.hwcooling.net\/?p=277575\/"},"modified":"2026-05-11T20:03:04","modified_gmt":"2026-05-11T18:03:04","slug":"amd-reportedly-preparing-new-am5-boards-or-chipsets-for-summer","status":"publish","type":"post","link":"https:\/\/www.hwcooling.net\/en\/amd-reportedly-preparing-new-am5-boards-or-chipsets-for-summer\/","title":{"rendered":"AMD reportedly preparing new AM5 boards or chipsets for summer"},"content":{"rendered":"

AMD is expected to launch the first Ryzen desktop CPUs based on the new Zen 6 architecture<\/a> either in autumn this year or early next year. Until now, there had been no indications that these CPUs would also bring the arrival of new chipsets. However, it now appears that a new wave of AM5 socket motherboards for these processors is in preparation. These models could come equipped with new capabilities and potentially a new chipset.<\/p>\n

As noted by VideoCardz, Biostar has now announced that the company will unveil a \u201cnew generation\u201d of motherboards for AMD processors next month at Computex. It has not been specified whether this new generation will be branded as an entirely new series (with 900-series chipsets), or whether it will instead be some form of platform refresh centered around 800-series chipsets. These new boards are expected to include certain new capabilities, however, so branding such as X970, B950, and similar is possible\u2014Intel will have a new platform with 900-series chipsets, so AMD and\/or motherboard vendors may also want their own \u201cnew\u201d generation.<\/p>\n

At this point, however, there is no information suggesting development of an entirely new chipset silicon has been underway. For that reason, it is unlikely AMD will unveil a truly new desktop chipset at Computex. It’s more likely\u2014even if the boards are branded as 900-series products (for example, if boards carry names such as X970E)\u2014that it will remain based on the same Promontory 21 silicon already used in B850, X870, X870E, and various 600-series chipset versions.<\/p>\n

The differences and new features will likely stem from the firmware level and from motherboard components other than the chipset itself. It appears these new boards could introduce support for CUDIMM (or CSO-DIMM) memory modules with integrated clock generators. These are apparently expected to become supported with Zen 6 processors, as already suggested by preparatory steps featured in EXPO 1.2 technology, which recently came to light. Some form of motherboard-side support may also be required for CUDIMM deployment, and new 900-series boards could offer this as their primary new feature.<\/p>\n