{"id":97141,"date":"2022-04-13T21:52:48","date_gmt":"2022-04-13T19:52:48","guid":{"rendered":"https:\/\/www.hwcooling.net\/?p=97141\/"},"modified":"2022-04-13T21:52:48","modified_gmt":"2022-04-13T19:52:48","slug":"zen-4-sp5-socket-and-5nm-amd-epyc-with-12-cpu-dies-pictured","status":"publish","type":"post","link":"https:\/\/www.hwcooling.net\/en\/zen-4-sp5-socket-and-5nm-amd-epyc-with-12-cpu-dies-pictured\/","title":{"rendered":"Zen 4: SP5 socket and 5nm AMD Epyc with 12 CPU dies pictured"},"content":{"rendered":"

Recently, the first test or sighting of a sample of AMD’s 5nm processor with the new Zen 4 architecture<\/a> appeared on the Internet. Now we also have the first photo. And not only the processor, but also the silicon – a delidded 96-core Epyc 7004 “Genoa” has made it to the Internet. We have a proof that Zen 4 uses CPU chiplets with eight cores and there will be a whole 12 of them and under the IHS of the processor.<\/p>\n

We now have a look at the version of the Zen 4 architecture meant for servers (for the record, AMD also showed a 5nm Ryzen<\/a> in January, but we only got a top view of the CPU covered by a heat spreader). First, an image of an Epyc 7004 processor sample was leaked, showing both the top and bottom of the processor. The orange plastic in the picture is the carrier used to insert the processor into the socket. A similar assembly is already used by current Epycs and Threadrippers.<\/p>\n

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AMD Epyc 7004 Genoa processor sample with Zen 4 architecture for socket SP5 (Source: VideoCardz)<\/figcaption><\/figure>\n

As you can see, the heat spreader is very large and the same is true, of course, for the bottom of the processor with the contacts. There should be 6096 of them. The increase compared to the 4094 contacts of current Epyc package is due to the fact that the processor will have a 12-channel DDR5 controller and possibly expanded connectivity. Some of the additional contacts will probably be used to boost the power supply, so that more current can be supplied to the CPU.<\/p>\n

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Sample of AMD Epyc 7004 Genoa processor with Zen 4 architecture, socket SP5, bottom side (Source: VideoCardz)<\/figcaption><\/figure>\n

But we also have fresh pictures of what’s hidden inside. You can see how the chipsets themselves sit on the CPU substrate below. It looks like the early leak from ExecutableFix<\/a> was accurate. Once again, the processor has one large central I\/O die and twelve CPU chiplets in a slightly counterintuitive arrangement (normally, we’d probably expect AMD to put them closer to the I\/O chiplet).<\/p>\n

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AMD Epyc 7004 Genoa, CPU chiplets and I\/O chiplet (Source: Malaysia\/@Phatal187)<\/figcaption><\/figure>\n

This means that the chiplet interconnect will probably be very similar to the Epyc 7002 and 7003 and uses simple communication wired through the substrate. So unfortunately AMD still hasn’t implemented some sort of more advanced interconnect technology similar to what is employed by Intel’s Sapphire Rapids<\/a>, or Apple’s M1 Ultra<\/a>. it is safe to assume this means the same will be true for the desktop Ryzen 7000 “Raphael”.<\/p>\n

The area of the CPU chiplet is very small, reportedly 72 mm\u00b2 (less than the 80 mm\u00b2 of Zen 3 compute dies; this is likely to lead to higher operating temperatures due to less contact area for cooling). Even the I\/O die is smaller (it has an area of 397 mm\u00b2) than in the previous generation despite having to support 50 % more interconnects to the CPU dies and 50 % more memory channels. Hopefully this is a confirmation that AMD has used some more modern manufacturing process and hopefully this will reduce the I\/O die’s power draw (which negatively offsets the efficiency of the 7nm Zen 2 and Zen 3 cores quite a bit, currently).<\/p>\n

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Socket SP5 for 5nm AMD Epyc processors (Source: ServeTheHome)<\/figcaption><\/figure>\n

Socket and schematics<\/h3>\n

A picture and schematics of the socket for these processors, which is called SP5, have also been leaked. It’s not entirely clear if existing coolers for today’s SP3\/TR4 socket can be used with it. It looks like the new socket has six mounting nuts (but we don’t know if maybe four of them will be in positions compatible with SP3 coolers). For the AM5 desktop socket, AMD designed it so that compatibility with AM4 coolers is retained<\/a>.<\/p>\n

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Socket SP5 for 5nm AMD Epyc processors, PCB schematic (Source: ServeTheHome)<\/figcaption><\/figure>\n

In addition to the Epyc 7004 processors with Zen 4 cores, you should also be able to install “cloud” processors with Zen 4C cores, which is a higher-density version of the architectur with up to 128 cores in total, intended as competition for ARM server CPUs. These processors are codenamed “Bergamo” and should come out a little later. The Epyc 7004 Genoa could hopefully be released as early as late 2022.<\/p>\n

Sources: VideoCardz (1<\/a>, 2<\/a>)<\/i><\/p>\n

English translation and edit by Jozef Dud\u00e1\u0161, original text by\u00a0Jan Ol\u0161an, editor for Cnews.cz<\/em><\/p>\n