MSI MEG X670E Ace: A truly extreme motherboard that… has it all

Ľubomír Samák

1 year ago

MSI MEG X670E Ace in detail

We haven’t tested modern motherboards for AMD platforms so far and all attention has been paid to boards with Intel chipsets. That will change now, at least for a while – more AMD X670(E) and B650(E) boards will be added to the tests, but the bar will be set high. We’re starting with MSI’s top-of-the-line MEG X670E Ace motherboard, which won’t be beaten by any other board “just like that”.

Motherboards on the new AMD platform (AM5) have been available since September and thus came less than a year after the alternative Intel LGA 1700 boards, of which we have already tested twelve in detail. We will build up a similar database for AMD chipset motherboards over time. And maybe even bigger, as there are more different AMD chipsets (and it won’t be different even after the January release of Intel B760), X670, X670E, B650 and B650E.

We have discussed the differences in features between the chipsets in a separate article. For the purposes of the MSI MEG X670E Ace tests, we will just state that the X670E chipset, on which I built, consists of two chips (+ “north bridge” in the processor) and it is the most feature-rich variant of all. And the MSI MEG X670E Ace motherboard makes very good use of these options.


Parameters		MSI MEG X670E Ace

Socket		AMD AM5
Chipset		AMD X670E
Format		E-ATX (305 × 277 mm)
CPU power delivery		25-phase
Supported memory (and max. frequency)		DDR5 (6666 MHz)
Slots PCIe ×16 (+ PCIe ×1)		3× (+ 0×)
Centre of socket to first PCIe ×16 slot		86 mm
Centre of socket to first DIMM slot		56 mm
Storage connectors		6× SATA III, 4× M.2 (1× PCIe 5.0 ×4: 60–80 mm + 2× M.2 PCIe 4.0 ×4: 60–80 mm + 1× PCIe 4.0 ×4: 80–110 mm)
PWM connectors for fans or AIO pump		8×
Internal USB ports		2× 3.2 gen. 2×2 type C, 1× 3.2 gen. 2×2 type C, 4× 3.2 gen. 1 type A, 4× 2.0 type A
Other internal connectors		1× TPM, 3× ARGB LED (5 V), 1× RGB LED (12 V), jumper Clear CMOS, 1× 6-pin (Quick Charge USB-C), 2× thermal sensor (2-pin), Water Flow, V-check point
POST display		yes
Buttons		Start, Reset, Flash BIOS, Clear CMOS, BIOS switch, ARGB LED switch, „Smart“
External USB ports		2× 3.2 gen. 2×2 type C, 1× 3.2 gen. 2 type C (with DP support), 8× 3.2 gen. 1 type A
Video outputs		1× DisplayPort 1.4 (via USB-C)
Network		1× RJ-45 (10 GbE) – Marvell AQC113CS-B1-C, WiFi 6E (802.11 a/b/g/n/ac/ax), Bluetooth 5.2
Audio		Realtek ALC4082 (7.1)
Other external connectors		–
Manufacturer's suggested retail price		701 EUR

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MSI MEG X670E Ace

MSI’s “Ace” series of motherboards has been gaining a lot of features between generations, and it could be noted that it has gradually jumped to a completely different class (than it was once in, for example, with the Z390 Ace). It’s a big jump from the X570 Ace, too. MSI MEG The X670E Ace is an elite motherboard with everything that goes with it, and overall it outshines even the older X570 Godlike from the higher-end lineup.

Compared to the X570 Ace, the board has grown in size, the X670E Ace is now E-ATX format. It is as much as 277 mm wide (i.e. extra 33 mm compared to ATX boards). This board will fit in many cases, but make sure that in yours, the motherboard’s PCB will not overlap the cable grommets.

Although it is a large board, the distance between the CPU socket and the first PCI Express ×16 slot is quite small. From the center of the CPU socket to the center of the PCIe slot, it is 86 mm. Some boards have as much as a centimeter more. This smaller spacing is here also because MSI doesn’t use the space above the PCIe slot to accommodate the M.2 slot, as motherboard manufacturers often do. However, even this layout shouldn’t affect compatibility with larger dual tower coolers. These will fit, but removing the graphics card from underneath will be more difficult due to less space. Especially when the X670E Ace only has a simple latch that you have to press directly on the slot. A similar mechanism to Asus’s Q-release with an unlatch button in an easy-to-reach location would be useful here.

From the back side, the board has a protective sheet that overlaps a large part of the PCB area: I deliberately do not refer to this as a “backplate”, because that is separate from this sheet. After removing the large cover, which is useful mainly to protect the PCB from scratches and also to reinforce it a bit, there is then something else to which the term backplate fits better. Namely a metal “L” profile into which the VRM heatsinks are screwed. This aluminium plate also absorbs heat, as it is in contact with the PCB via thermal pads.

The heatsink on the other side, which is directly in contact with the housing of the voltage regulators and coils, is designed very sensibly – effectively. There are thin fins stacked on a sturdy base, and there are really quite a lot of them. The emissive area is so huge, and a heatpipe is also used for better heat distribution, which makes efficient use of parts of the heatsink, under which the voltage regulators don’t heat up as much (as elsewhere).

And speaking of those voltage regulators: MSI reached for the Infineon TDA21490. The current load per phase is 90 A. But the board has so many phases (25) that all of them do not fit completely into the thermal image from the usual shorter distance. The total current capacity is thus 2250 A, while for the CPU it is 1980 A. Considering the PPT for the most powerful of the Ryzen 7000 processors (Ryzen 9 7950X), 230 W, such a design is also suitable for massive overclocking. Via PBO, but also manually, for enthusiasts. On the X670E Ace it is also possible to activate an LN2 mode for extreme overclocking. For completeness it should be added that the control chip of the power delivery is the Infineon XDPE192C3B.

The layout of some elements of the motherboard is quite unusual. For example, two 8-pin power connectors for the processor are located on the top right, and the first M.2 slot for SSDs fits between the 24-pin ATX connector and the DIMM slots (for DDR5 memory). The slot supports PCI Express 5.0 and has a heatsink with a latch on it, which doesn’t require a screwdriver. The heatsink has a sliding mechanism on the top to release it.. On the bottom, it is held in place by two tabs resting on “U” shaped grooves.

Then, the board has three more M.2 slots. These are no longer brought out from the CPU, but from the south bridge of the chipset. All of them support PCIe 4.0 (but none of them SATA) and SSDs at least up to 80 mm in length. You can also fit an SSD with an above-standard length of 110 mm into the bottom one (M.2_4). This slot has a heatsink with integrated ARGB LED lighting that connects via a fixed (cableless) proprietary connector.

There are a lot of options on the MSI MEG X670E Ace that cheaper boards usually lack. One of them is a central switch for ARGB LEDs, right next to it is a switch between the two BIOSes you can have on the board. To better control the temperature of any part, two temperature sensors can also be attached to the board, which will report in the motherboard monitoring applications.

There are two internal USB-C 3.2 gen. 2×2 connectors, both with power delivery support. So you can eventually power a laptop on the more low-power side from the front panel of the computer case. In order for this to work, you need to connect the 6-pin connector next to the 24-pin ATX connector. You will use a PCIe connector for this, the same connector that is used for external graphics card power. It should be noted, however, that the case cabling must be suitably adapted for the higher current load. With inadequate wiring, you will not get to the specified 60 W.

External connector configuration includes up to three USB-C ports. Two of them are 20-gigabit (standard 3.2 gen. 2×2) and one 10-gigabit (3.2 gen. 2) which supports DisplayPort 1.4. There’s no other video output on this board. Though there is room for up to eight fast USB Type-A ports with the 3.2 gen. 2 standard. MSI has not brought the slower (3.2 gen. 1) and slow (2.0) ones externally to the rear panel. Instead, two SMA connectors for WiFi antennas are brought out, and the full lineup includes a number of audio jacks (five 3.5mm jacks and optical S/PDIF). The audio adapter is built on a Realtek ALC4080 chip and an ESS ES9280AQ DAC/HPA.

Among the things that we can boldly describe as above-standard and rare is the 10-gigabit Ethernet (Marvell AQC113CS-B1-C adapter). And what’s the “Smart” button for? That’s up to the user. Various functions can be assigned to it. In addition to motherboard reset, there is also “Safe Boost”, “Turbo Fan” and it can also be an illumination switch.

The most prominent illumination (with the dragon logo) is on the cover between the VRM and the motherboard’s external connectors. The text “Ace” is then illuminated on the bottom SSD heatsink, and the chipset heatsink has an illuminated triangle to symbolize the MEG product class.

We almost forgot about the PCI Express ×16 slot expansion card for connecting two M.2 SSDs in all formats, from 40 to 110 mm.

Only PCIe SSDs are supported (including the expected fifth-generation models with this interface), and due to the large, 390-gram heatsink with active cooling, it can handle high SSD loads even under adverse conditions (weaker system cooling, higher ambient air temperature, etc.). But the fan can always be turned off, there’s a switch on the card for that too. There are temperature sensors under each slot to monitor the SSD surface temperature.

What it looks like in the BIOS

The UEFI start screen is probably not particularly surprising. The “EZ Mode” layout doesn’t change much from generation to generation. There is a fairly comprehensive overview of all components. Some details you can’t see right away, without your intervention, and you have to click through the tabs on the left (Memory, Storage, Fan Info, … the CPU tab is the default) to see the details.

From the EZ Mode environment it is possible to activate EXPO for memory (similar to XMP), force Game Boost for higher CPU clock speeds under gaming load and with one of the buttons you can turn off the segmented POST display, which can be distracting for some.

But for Resizable BAR management, you have to go into more advanced settings. Thus, if you want to disable ReBAR for some reason (for example, because it reduces performance in your application), it is enabled in the default settings. Now we are already in advanced mode, the Settings tab.

Advanced settings around power supply management, clock speeds and such are already in the “OC” tab. If you can keep it cool, then at different intensities with different limits, you can overclock the processor via PBO.

But more than increasing CPU clock speeds, reducing the TDP is popular in the context of more powerful processors, where the PPT is still 230 W at the original 170 W. At a TDP of 105 W, the PPT (+35 %) is only 142 W, i.e. at the level of the previous generation of AMD processors (Ryzen 5000, Vermeer). This is how we set it for the reduced power mode, in the charts with the “Eco” label. Such a load, by the way, also roughly corresponds to the Ryzen 7 7700X and Ryzen 5 7600X processors, which have a TDP of 105 W with a PPT of 142 W.

However, you can also limit the PPT manually to exactly what you need (also taking into account the cooling system’s capabilities). To adjust the LLC you need to go into the detailed settings of the power delivery (DigiALL Power tab), where you can also set the critical temperature of the VRM, at which the system will probably crash into a black screen.

One of the features that MSI added to the BIOS over time (after the release of this board) is AVX instruction management. These can be disabled (including AVX-512) so that supported applications do not use them. The performance achieved will naturally be lower (significantly so in AI Topaz Labs applications, for example), but apparently there are enough situations where users are happy to eliminate the rather inefficient implementation of these instructions in most cases (and thus reduce both power draw and temperature).

The “Hardware Monitor” interface is one of the most advanced there is. Up to seven different temperature sources can be assigned to the eight connectors with individual setting of the development curves. Among the sensors there are also two positions for installing optional thermocouples, which can be found in the motherboard accessories.

Gaming tests…

The vast majority of tests is based on the methodology for processors and graphics cards. The choice of games is narrower with motherboards, but for this purpose there is no need for more of them. The processor we use is always the powerful AMD Ryzen 9 7950X or on Intel platforms It’s the Core i9-13900K. These processors highlight both the strengths and weaknesses of any motherboard well. In the past we have tested with two processors, including a cheaper, more low-power model, but we don’t do that anymore. The hypothesis that more expensive motherboards might give an “advantage” to cheaper processors in performance has not been confirmed, so it’s rather pointless.

We’ve selected five titles from games we’re testing in two resolutions. There are significantly fewer games than in the CPU or graphics card tests, but these are just enough for the motherboard tests. Few people consider performance in a particular game when choosing a motherboard. But an indicative overview of which motherboard shapes gaming performance in what way (compared to another motherboard) is necessary. To avoid significant discrepancies over time, we’ve reached for relatively older titles that no longer receive significant updates.

These are Borderlands 3, F1 2020, Metro Exodus, Shadow of the Tomb Raider and Total War Saga: Troy. With newer games, there might be some performance changes over time (updates) and especially in high resolutions with high details. This is one of the test setups (2160p and Ultra, or the highest visual detail but without ray-tracing graphics) that focuses on comparing performance, for which the bottleneck is the graphics card. In other words, it will be clear from these tests which motherboard can affect the performance of which graphics card to what extent for any reasons. In contrast, a setup with Full HD resolution and with graphical details reduced to “High” will also reflect the CPU’s contribution to the final gaming performance.

We use OCAT to record fps, or the times of individual frames, which are then used to calculate fps, and FLAT to analyze the CSV. The developer and author of articles (and videos) for the GPUreport.cz website is behind both.
For the highest accuracy, all runs are repeated three times and average values of average and minimum fps are displayed in the graphs. These multiple repetitions also apply to non-game tests.

… Computing tests, SSD tests, USB ports and network tests

We test application performance in a very similar way to the processor tests. Almost all tests are included, from the easier ones (such as those in a web environment) to those that push the CPU or graphics card to the limit. These are typically tests such as 3D rendering, video encoding (x264, x265, SVT-AV1) or other performance-intensive computing tasks. As with processors or graphics cards, we have a wide range of applications – users editing video (Adobe Premiere Pro, DaVinci Resolve Studio), graphic effects creators (Adobe Premiere Pro), graphic designers or photographers (Adobe Photoshop and Lightroom, Affinity Photo, AI applications Topaz Labs, …) will find their own in the results, and there are also tests of (de)encryption, (de)compression, numerical calculations, simulations and, of course, tests of memory.

SSD performance tests are also important for motherboards. Therefore we test the maximum sequential read and write speeds on an empty Samsung 980 Pro SSD (1 TB) in the well distributed CrystalDiskMark, in all slots. We approach the USB port tests in the same way. We use a WD Black P50 external SSD to test them. It supports fast USB 3.2 gen. 2×2, so it won’t be a bottleneck for even the fastest USB controllers. We report only one result for each USB standard. This is calculated from the average of all available ports.

We won’t deprive you of network bandwidth tests either. We move large files in both directions within a local network between the motherboard network adapters and the Sonnet Solo10G 10-gigabit PCIe card. This from the aforementioned Samsung 980 Pro SSD to the Patriot Hellfire (480 GB), which is still fast enough to not slow down even the 10 Gb adapter.

The results of all performance tests are averaged over three repeated measurements for high accuracy.

CPU settings…

We primarily test processors without power limits, the way most motherboards have it in factory settings. For tests that have an overlap with power, temperature and CPU clock speed measurements, we also observe the behavior of boards with a power limit according to Intel’s recommendations, where we set PL1 to the TDP level (125 W) while respecting the Tau timeout (56 s). The upper limit of the power supply (PL2/PTT) is set in the BIOS according to the official values. For Core i9-13900K it is 253 W, for Core i9-12900K it is 241 W. On AMD platforms with the Ryzen 7950X test processor, the reduced power supply mode represents a TDP setting of 105W with a PPT of 142W. Such a load also corresponds to unconstrained power supply of the Ryzen 7 7700X and Ryzen 5 7600X processors. Aggressive overclocking technologies such as PBO2 (AMD) or MCE (Asus) and similar are not covered in standard motherboard tests.

… and application updates

Tests should also take into account that over time, individual updates may skew performance comparisons. Some applications we use in portable versions that do not update or can be kept on a stable version, but for some this is not the case. Typically games get updated over time, which is natural, and keeping them on old versions out of reality would also be questionable.

In short, just count on the fact that the accuracy of the results you are comparing with each other decreases a bit as time goes on. To make this analysis easier, we’ve listed when each board was tested. You can find this out in the dialog box, where you can find information about the date of testing. This dialog is displayed in the interactive graphs, next to any result bar. Just hover over it.

Methodology: How we measure power draw

In contrast to the Z690/B660 tests, we’ll simplify it a bit and measure only the CPU power draw on the EPS cables. This means that (also for the sake of best possible clarity) we omit the 24-pin measurements. We have already analysed it thoroughly and the power draw on it doesn’t change much across boards. Of the ten boards tested with an Alder Lake processor (Core i9-12900K), the power draw at 12 volts of the 24-pin connector ranges from 37.3–40.4 W (gaming load, graphics card power supply via PCI Express ×16 slot), at 5V (memory, ARGB LEDs and some external controllers) then between 13.9–22.3 W and finally at the weakest, 3.3-volt branch, the power draw of our test setup tends to be 2.2–3.6 W.

On top of the CPU power draw, which also takes into account the efficiency of the power delivery, this adds up to some 53–66 W under gaming/graphics load and only 15–25 W outside of it, with the graphics card idle. We already know all this from older tests, and it will be no different on the new boards, and as the number of measurements increases, reducing measurements that worsen orientation is beneficial. But from the text above, you know how much to add for the total power draw of the motherboard components to the CPU’s majority power draw.

The situation will be a bit different on AMD platforms, for those we will deal with what is the power draw on which branch of the 24-pin, but already in a separate article that will better highlight this topic. In a large comprehensive motherboard test, these measurements disappear, they do not attract enough attention.

We measure the power draw of the CPU (and its VRM) on the power supply cables, with calibrated Prova 15 current clamps and a calibrated Keysight U1231A multimeter. The clamps measure the electric current, the multimeter measures the electric voltage. In the union of these two electrical quantities, we finally obtain the exact power draw. We measure this in different loads on the CPU. The maximum multithreaded load is represented by Cinebench R23.

Lower, gaming load by Shadow of the Tomb Raider (1080p@high), single-threaded load by audio encoding (reference encoder 1.3.2, FLAC with bitrate 200 kbps) and idle power draw is measured on the Windows 10 desktop when only basic operating system processes and launchers of some test applications are running in the background.

Methodology: Temperature and frequency measurements

By far the most critical part in terms of temperatures on the motherboard is the power delivery (VRM) for the CPU. This is where we return to the Fluke Ti125 thermal imager, which produces temperature maps that can be used to locate the average temperature, as well as the hottest point. We record both these values (average and maximum temperature on the Vcore) in graphs, and we will later evaluate the efficiency of the VRM heatsinks based on the maximum one. However, we lack a suitable thermometer for that yet. Of course, the thermovision is implemented without a heatsink, and a thermocouple needs to be installed on the hottest MOSFET to detect the reduction of temperature with a heatsink. This will be added soon.

Thermal imaging always relates to operating with the more powerful of the pair of test processors. With it, the differences and possible limitations or impending risks (for example, even from thermal throttling) become more apparent. In order to have a good view of the VRM, we use an Alphacool Eisbaer 360 liquid cooler with the fans fixed at full power (12 V) instead of a tower cooler (from the CPU tests). The temperature tests also include CPU temperatures for completeness, and we also test the efficiency of the supplied SSD heatsinks as part of the motherboard tests. These are already included with virtually all better motherboards, and so the question naturally arises whether to use them or replace them with other, more finned ones. We will test these heatsinks on a Samsung 980 Pro SSD during ten minutes of intense load in CrystalDiskMark. Finally, the temperature of the chipset’s southbridge and the cooling efficiency in this direction is noteworthy as well.

All tests are conducted in a wind tunnel, so full system cooling is provided. This consists of three Noctua NF-S12A PWMs@5V (~550 rpm) . Two of which are intake, one is exhaust. But the three fast AIO fans also function as exhaust fans, so there is underpressure in the case.

The temperature at the entrance to the tunnel is properly controlled and ranges between 21-21.3 °C. Maintaining a constant temperature at all times during testing is important not only for the accuracy of the temperature measurements, but also because a higher or lower ambient temperature also affects the eventual behaviour of the processors’ boost. And we also properly monitor and compare the clock speeds, whether under all-core load or even single-threaded tasks. We use the HWiNFO application to record the clock speeds and temperatures of the cores (sampling is set to two seconds).

Maintaining a constant temperature at the intake is necessary not only for a proper comparison of processor temperatures, but especially for objective performance comparisons. The clock speed development, and specially the single core boost, is precisely based on the temperature. Typically in summer, at higher temperatures than is normal in living quarters in winter, processors can be slower.

Temperatures are always read as maximum (both from the VRM thermovision and average, but still from the local maximum values at the end of Cinebench R23). For Intel processors, for each test we read the maximum temperature of the cores, usually all of them. These maxima are then averaged and the result represents the final value in the graph. From the single-threaded workload outputs, we extract only the recorded values from the active cores (there are usually two of these, and they alternate between each other during the test). For AMD processors it is a bit different. They don’t have temperature sensors for each core. In order to make the procedure methodically as similar as possible to the one we apply on Intel processors, we define the average temperature of all cores by the highest value reported by the CPU Tdie (average) sensor. However, for single-core workloads we already use the CPU sensor (Tctl/Tdie), which usually reports a slightly higher value that better corresponds to hotspots of one or two cores. However, these values as well as the values from all internal sensors should be taken with a grain of salt, the accuracy of sensors across CPUs varies.

Clock speed evaluation is more accurate, each core has its own sensor even on AMD processors. However, unlike the temperatures, we write the average values of the clock speeds during the tests in the graphs. We monitor the temperatures and clock speed of the CPU cores in the same tests in which we also measure power draw. Thus, sequentially from the lowest desktop idle load in Windows 10, through audio encoding (single-threaded load), gaming load in Shadow of the Tomb Raider to Cinebench R23.

MWe haven’t tested modern motherboards for AMD platforms so far and all attention has been paid to boards with Intel chipsets. That will change now, at least for a while – more AMD X670(E) and B650(E) boards will be added to the tests, but the bar will be set high. We’re starting with MSI’s top-of-the-line MEG X670E Ace motherboard, which won’t be beaten by any other board “just like that”.

Test setup

Alphacool Eisbaer Aurora 360 liquid cooler w/ a metal backplate

G.Skill Trident Z5 Neo memory (2×16 GB, 6000 MHz/CL30). Motherboards with DDR4 memory support are tested with Patriot Blackout (4×8 GB, 3600 MHz/CL18) and Z690/B660 motherboards with DDR5 memory support were tested with Kingston Fury Beast (2×16 GB, 5200 MHz/CL40)

MSI RTX 3080 Gaming X Trio graphics card

Patriot Viper VP4100 (1 TB) and Patriot Viper VPN100 (2 TB) SSDs

Note.: Graphics drivers used at the time of testing: Nvidia GeForce 466.77 and OS Windows 10 build 19045.

3DMark

We use 3DMark Professional for our tests and from the tests, Night Raid (DirectX 12), Fire Strike (DirectX 11) and Time Spy (DirectX 12). In the graphs you will find the CPU sub-scores, the combined scores, as well as the graphics scores. From this you can see to what extent a given CPU is limiting the graphics card.

Borderlands 3

Test environment: resolution 1920 × 1080 px; graphics settings preset High; API DirectX 12; extra settings Anti-Aliasing: None; test scene: built-in benchmark.

Test environment: resolution 3840 × 2160 px; graphics settings preset Ultra; API DirectX 12; no extra settings; test scene: built-in benchmark.

F1 2020

Test environment: resolution 1920 × 1080 px; graphics settings preset High; API DirectX 12; extra settings Anti-Aliasing: off, Skidmarks Blending: off; test scene: built-in benchmark (Australia, Clear/Dry, Cycle).

Test environment: resolution 3840 × 2160 px; graphics settings preset Ultra High; API DirectX 12; extra settings Anti-Aliasing: TAA, Skidmarks Blending: off; test scene: built-in benchmark (Australia, Clear/Dry, Cycle).

Metro Exodus

Test environment: resolution 1920 × 1080 px; graphics settings preset High; API DirectX 12; no extra settings; test scene: built-in benchmark.

Test environment: resolution 3840 × 2160 px; graphics settings preset Extreme; API DirectX 12; no extra settings; test scene: built-in benchmark.

Shadow of the Tomb Raider

Test environment: resolution 1920 × 1080 px; graphics settings preset High; API DirectX 12; extra settings Anti-Aliasing: off; test scene: built-in benchmark.

Test environment: resolution 3840 × 2160 px; graphics settings preset Highest; API DirectX 12; extra settings Anti-Aliasing: TAA; test scene: built-in benchmark.

Total War Saga: Troy

Test environment: resolution 1920 × 1080 px; graphics settings preset High; API DirectX 11; no extra settings; test scene: built-in benchmark.

Test environment: resolution 3840 × 2160 px; graphics settings preset Ultra; API DirectX 11; no extra settings; test scene: built-in benchmark.

PCMark

Geekbench

Speedometer (2.0) and Octane (2.0)

Test environment: To ensure that results are not affected by web browser updates over time, we use a portable version of Google Chrome (91.0.472.101), a 64-bit build. Hardware GPU acceleration is enabled as well, as it is by default for every user.

Note: The values in the graphs represent the average of the scores obtained in the subtasks, which are grouped according to their nature into seven categories (Core language features, Memory and GC, Strings and arrays, Virtual machine and GC, Loading and Parsing, Bit and Math operations, and Compiler and GC latency).

Cinebench R20

Cinebench R23

Blender@Cycles

Test environment: We use well distributed projects BMW (510 tiles) and Classroom (2040 tiles) and the renderer Cycles. Render settings are set to None, with which all the work falls on the CPU.

LuxRender (SPECworkstation 3.1)

Adobe Premiere Pro (PugetBench)

Test environment: PugetBench tests set. We keep the version of the application (Adobe Premiere Pro) at 15.2.

DaVinci Resolve Studio (PugetBench)

Test environment: set of PugetBench tests, test type: standard. App version of DaVinci Resolve Studio is 17.2.1 (build 12).

Graphics effects: Adobe After Effects

Test environment: set of PugetBench tests. App version of Adobe After Effects is 18.2.1.

HandBrake

Test environment: For video conversion we’re using a 4K video LG Demo Snowboard with a 43,9 Mb/s bitrate. AVC (x264) and HEVC (x265) profiles are set for high quality and encoder profiles are “slow”. HandBrake version is 1.3.3 (2020061300).

x264 and x265 benchmarks

Naposledy sme sa zaoberali základnou doskou, ktorá, ktorá je aj vďaka nižšej cene vhodná najmä na použitie s lacnejšími procesormi. Teraz tu máme o zhruba 50 eur drahšiu Gigabyte B660 Aorus Master DDR4. Príplatok tu má jasné opodstatnenie a odzkadľuje sa na lepších vlastnostiach. Napájacia kaskáda je výrazne efektívnejšia, chladiče sú účinnejšie a výbava je celkovo bohatšia, vrátane svetielok.

Audio encoding

Test environment: Audio encoding is done using command line encoders, we measure the time it takes for the conversion to finish. The same 42-minute long 16-bit WAV file (stereo) with 44.1 kHz is always used (Love Over Gold by Dire Straits album rip in a single audio file).

Encoder settings are selected to achieve maximum or near maximum compression. The bitrate is relatively high, with the exception of lossless FLAC of about 200 kb/s.

Note: These tests measure single-thread performance.

FLAC: reference encoder 1.3.2, 64-bit build. Launch options: flac.exe -s -8 -m -e -p -f

MP3: encoder lame3.100.1, 64-bit build (Intel 19 Compiler) from RareWares. Launch options: lame.exe -S -V 0 -q 0

AAC: uses Apple QuickTime libraries, invoked through the application from the command line, QAAC 2.72, 64-bit build, Intel 19 Compiler (does not require installation of the whole Apple package). Launch options: qaac64.exe -V 100 -s -q 2

Opus: reference encoder 1.3.1, Launch options: opusenc.exe –comp 10 –quiet –vbr –bitrate 192

Adobe Photoshop (PugetBench)

Test environment: set of PugetBench tests. App version of Adobe Photoshop is 22.4.2.

Affinity Photo (benchmark)

Test environment: built-in benchmark.

Topaz Labs AI apps

Topaz DeNoise AI, Gigapixel AI and Sharpen AI. These single-purpose applications are used for restoration of low-quality photos. Whether it is high noise (caused by higher ISO), raster level (typically after cropping) or when something needs extra focus. The AI performance is always used.

Test settings for Topaz Labs applications. DeNoise AI, Gigapixel AI and Sharpen AI, left to right. Each application has one of the three windows

Test environment: As part of batch editing, 42 photos with a lower resolution of 1920 × 1280 px are processed, with the settings from the images above. DeNoise AI is in version 3.1.2, Gigapixel in 5.5.2 and Sharpen AI in 3.1.2.

The processor is used for acceleration (and high RAM allocation), but you can also switch to the GPU

WinRAR 6.01

7-Zip 19.00

TrueCrypt 7.1a

Aida64 (AES, SHA3)

Aida64, FPU tests

FSI (SPECworkstation 3.1)

Kirchhoff migration (SPECworkstation 3.1)

Python36 (SPECworkstation 3.1)

SRMP (SPECworkstation 3.1)

Octave (SPECworkstation 3.1)

FFTW (SPECworkstation 3.1)

Convolution (SPECworkstation 3.1)

CalculiX (SPECworkstation 3.1)

RodiniaLifeSci (SPECworkstation 3.1)

WPCcfd (SPECworkstation 3.1)

Poisson (SPECworkstation 3.1)

LAMMPS (SPECworkstation 3.1)

NAMD (SPECworkstation 3.1)

Memory tests…

… and cache (L1, L2, L3)

M.2 (SSD) slots speed

USB ports speed

Ethernet speed

Na meranie prenosových rýchlostí LAN adaptérov používame v druhej testovacej zostave sieťovú kartu Sonnet Solo10G

Analysis of power draw without power limits

Analysis of power draw with power limits

Achieved CPU clock speed w/o power limits…

… and with power limits

Disclaimer: The temperatures of the Core i9-12900K with the Core i9-13900K are incomparable. With the Intel Raptor Lake processor (Core i9-13900K) we use a metal backplate, while with Alder Lake (Core i9-12900K) the Alphacool Eisbaer Aurora 360 cooler has a plastic backplate. The latter has lower pressure and the heat transfer intensity is worse, as our tests show.

… and with power limits

VRM temperature w/o power limits…

… and with power limits

SSD temperature

Chipset temperature (south bridge)

Note: For motherboards with AMD X670 and X670E chipsets, whose south bridge consists of two chips, the charts show the average of the maximum temperatures of each of them.

Conclusion

By far the best equipped board we’ve tested this year. At the same time, the MSI MEG X670E Ace is also the most expensive, but only by “pennies” compared to the Asus ROG Maximus Z690 Hero. The price comparison across platforms is rather unfortunate, but we don’t have other motherboards with AMD chipsets to compare yet. What we do have, however, is a bunch of test results based on which we can put the X670E Ace onto a pedestal.

The power delivery is absolutely insane (in the best sense of the word) and significantly oversized, even considering the needs of the most powerful processor you can currently install in this board. With the Ryzen 9 7950X with PPT at 230 W without VRM heatsinks, we measured only 56°C at the hottest point (on the voltage regulator), then 51°C on average. These are results that clearly encourage manual overclocking or with PBO. The MSI MEG X670E Ace won’t be a bottleneck, it’s going to be trickier with the cooling of the CPU itself (you can’t do without a proper custom loop). The power delivery of this board is very efficient and that includes the power management. The measured power draw on EPS cables with R9 7950X is “only” 218 W. You will see that the boards that we will gradually add will usually not perform this well and their price/performance ratio will be weaker.

We did not encounter performance deficiencies in any of the hundreds of tests. Perhaps only the speeds of the M.2 slots are below average compared to the Intel platform (Zx90/B660), and after testing the first board with an AMD chipset, it’s hard to conclude whether or not this is common on this platform. We shall see about this. While those speeds for M.2 slots are relatively lower, these are not major differences. The X670E Ace is dramatically above other boards when it comes to ethernet bandwidth. Thanks to the 10 Gb adapter support, we can report download speeds of around 1.1 GB/s. Upload is a bit slower, 955 MB/s. However, there may also be a bottleneck here in the network card of the second test setup.

The SSD cooler on the M.2 slot with PCI Express 5.0 support is one of the most efficient ones and its particularly quick installation, which requires no tools (just dexterous fingers) is also worth praising. The MSI MEG X670E Ace collects a lot of plus points for its outstanding features. In addition to the things we’ve already mentioned, there are two internal USB-C gen. 2×2 connectors with an additional power supply (to be able to deliver 60 W), eleven fast internal connectors, none of which are below the 10 Gb standard (3.2 gen. 2), and in addition to this, the expansion card positions for two M.2 SSDs with PCIe 5.0 support.

The above-standard fan connection and control options should also be highlighted: Eight connectors and seven temperature sources on which the speed development can be based, and finally, we will reiterate the main thing – the extremely robust power delivery and the overall efficient operation. That is, except outside of a load, where it is relatively high at 30 W. Whether this is due to properties of the board or the processor, we will find out later.

Although the MSI MEG X670E Ace is a perfect motherboard from a technical point of view, it is not a suitable hardware for everyone. For casual use, where you fit the processor, set the memory profile (EXPO) and don’t care about anything else, it is most definitely an unnecessary luxury no matter what processor you use. However, with this board, you won’t stumble with a build tuned for the highest performance currently available.

English translation and edit by Jozef Dudáš


MSI MEG X670E Ace
+ Extremely powerful 25-phase power delivery (VRM)...
+ ... can handle an overclocked Ryzen 9 7950X with headroom
+ Very efficient power supply management
+ Low VRM temperature even at high power draw without heatsinks
+ Effective VRM heatsink with much pronounced fins
+ Four fast (four-lane) M.2 SSD slots...
+ ... as much as six of them after counting the additional two on the included expansion card
+ Up to eleven fast USB 3.2 gen. 2(×2) connectors on the rear I/O panel...
+ ... and internally, two USB-C 3.2 gen. 2 connectors with additional power supply
+ Extremely detailed fan management options
+ High-speed, 10-gigabit network
- Very high price
- Smaller spacing of the first PCIe ×16 slot from the processor socket
Manufacturer's suggested retail price: 701 EUR

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Some of the tested motherboards are also available in the Datacomp e-shop

Special thanks to Blackmagic Design (for licenses for DeNoise AI, Gigapixel AI and Sharpen AI) and Topaz Labs (for licenses for DeNoise AI, Gigapixel AI and Sharpen AI)

Continue: What it looks like in the BIOS