Intel Core i3-13100F in detail
Within the Raptor Lake-S CPU segmentation, it belongs to the lowest class (Core i3), but at the same time it is the fastest 4-core processor at all. AMD hasn’t had anything that directly competes with the Core i3-1x10xF processors in this segment for quite some time. So Intel, alone in the field, is pushing these processors in small steps, and the Ci3-13100(F) is already a very well “polished” foundation for budget gaming PCs.
Intel Core i3-13100F in detail
Although this processor belongs to the “Raptor Lake” family, it uses the same silicon chip as some models from the previous generation (Alder Lake). Namely the Core i3-12100F and the Core i5-12400(F) stepping H0 with a smaller chip (instead of the “big” one with 8P+8E cores, stepping C0), which physically has only six P cores and no E cores.
On the outside, the Core i3-13100F appears to be a very small evolution of the Core i3-12100F. It’s still a 4-core processor with 8 threads (the Core i3-1010x/F was built on the Skylake architecture), but with higher clock speeds at all levels. From base (+100 MHz; 3.4 GHz), through all-core boost (+200 MHz; 4.3 GHz) to single-core boost (+200 MHz; 4.5 GHz).
The more aggressive clock speeds of the Ci3-13100(F) compared to the Ci3-12100(F) should not, according to the parameters, have a negative impact on power draw or more precisely on the TDP. This is the same as the previous generation at 58 W and PL2 remains at 89 W. Although these values do not reflect the power draw, the thermal performance is directly related to it. Especially when it comes to chips produced with the same manufacturing process (Intel 7), the same mounting and, thirdly, the same die area (about 160 mm2).
Only Turbo Boost 2.0 is still supported, which means that in practice the boost clock speeds at which single-threaded applications run are lower (compared to models with TB 3.0 support). Turbo Boost is able to take advantage of the fact that some of the CPU cores may be faster than others and raise the clock speed higher than is possible with Turbo Boost 2.0. The latter is limited by the clock speed that any of the CPU cores must be able to handle. For cheaper processors, the achievable clock speeds can be “artificially” limited but also by Intel’s decision (given the higher attractiveness of the more expensive models) rather than by physical capabilities.
The chip is soldered to the IHS and the package includes the Intel Laminar RM1 cooler. Its analysis can also be found in our tests, from which we can conclude that in combination with the Core i3 power class, it not only keeps the processor cool, but can also stay relatively quiet while doing it.
The Core i3-13100(F) processors also support 16 PCI Express 5.0 lanes and have dual memory controllers. In addition to DDR5 memory, cheaper DDR4 modules are still supported. These will be more attractive to most users who are buying this processor with the vision of a thoroughly inexpensive build. But for a more accurate comparison, especially with cheaper AMD processors that no longer support DDR4 memory, we use DDR5 modules for tests, slower ones (5200 MHz, CL40) .
Although we are testing a model without an integrated graphics core (13100F), there is also a variant with an iGPU (UHD 730) – 13100 – without the ‘F’ in the name. The latter targets primarily office or multimedia configurations, the 13400F is closer to gaming as it requires the addition of a graphics card.
Manufacturer | Intel | Intel | Intel | |
Line | Core i3 | Core i3 | Core i3 | |
SKU | 13100F | 12100F | 10105F | |
Codename | Raptor Lake | Alder Lake | Comet Lake | |
CPU microarchitecture | Golden Cove (P) | Golden Cove (P) | Skylake | |
Manufacturing node | 7 nm | 7 nm | 14 nm | |
Socket | LGA 1700 | LGA 1700 | LGA 1200 | |
Launch date | 01/04/2023 | 01/04/2022 | Q1/2021 | |
Launch price | 109 USD | 97 USD | 97 USD | |
Core count | 4 | 4 | 4 | |
Thread count | 8 | 8 | 8 | |
Base frequency | 3.4 GHz (P) | 3.3 GHz (P) | 3.7 GHz | |
Max. Boost (1 core) | 4.5 GHz (P) | 4.3 GHz (P) | 4.4 GHz | |
Max. boost (all-core) | 4.3 GHz | 4.1 GHz (P) | 4.2 GHz | |
Typ boostu | TB 2.0 | TB 2.0 | TB 2.0 | |
L1i cache | 32 kB/core (P) | 32 kB/core (P) | 32 kB/core | |
L1d cache | 48 kB/core (P) | 48 kB/core (P) | 32 kB/core | |
L2 cache | 1.25 MB/core (P) | 1.25 MB/core (P) | 256 kB/core | |
L3 cache | 1× 12 MB | 1× 12 MB | 1× 6 MB | |
TDP | 58 W | 58 W | 65 W | |
Max. power draw during boost | 89 W (PL2) | 89 W (PL2) | 90 W (PL2) | |
Overclocking support | No | No | No | |
Memory (RAM) support | DDR5-4800/DDR4-3200 | DDR5-4800/DDR4-3200 | DDR4-2666 | |
Memory channel count | 2× 64 bit | 2× 64 bit | 2× 64 bit | |
RAM bandwidth | 76.8 GB/s or 512 GB/s (DDR4) | 76.8 GB/s or 51.2 GB/s (DDR4) | 42.7 GB/s | |
ECC RAM support | No | No | No | |
PCI Express support | 5.0/4.0 | 5.0/4.0 | 3.0 | |
PCI Express lanes | ×16 (5.0) + ×4 (4.0) | ×16 (5.0) + ×4 (4.0) | ×16 | |
Chipset downlink | DMI 4.0 ×8 | DMI 4.0 ×8 | DMI 3.0 ×4 | |
Chipset downlink bandwidth | 16.0 GB/s duplex | 16.0 GB/s duplex | 4.0 GB/s duplex | |
BCLK | 100 MHz | 100 MHz | 100 MHz | |
Die size | ~160 mm² | ~160 mm² | 149.6 mm² | |
Transistor count | ? bn. | ? bn. | ? bn. | |
TIM used under IHS | Solder | Solder | Paste | |
Boxed cooler in package | Intel Laminar RM1 | Intel Laminar RM1 | top-flow with copper core | |
Instruction set extensions | SSE4.2, AVX2, FMA, SHA, VNNI (256-bit), GNA 3.0, VAES (256-bit), vPro | SSE4.2, AVX2, FMA, SHA, VNNI (256-bit), GNA 2.0, VAES (256-bit) | SSE4.2, AVX2, FMA, SGX | |
Virtualization | VT-x, VT-d, EPT | VT-x, VT-d, EPT | VT-x, VT-d, EPT | |
Integrated GPU | N/A | N/A | N/A | |
GPU architecture | – | – | – | |
GPU: shader count | – | – | – | |
GPU: TMU count | – | – | – | |
GPU: ROP count | – | – | – | |
GPU frequency | – | – | – | |
Display outputs | – | – | – | |
Max. resolution | – | – | – | |
HW video decode | – | – | – | |
HW video encode | – | – | – |
- Contents
- Intel Core i3-13100F in detail
- Methodology: performance tests
- Methodology: how we measure power draw
- Methodology: temperature and clock speed tests
- Test setup
- 3DMark
- Assassin’s Creed: Valhalla
- Borderlands 3
- Counter-Strike: GO
- Cyberpunk 2077
- DOOM Eternal
- F1 2020
- Metro Exodus
- Microsoft Flight Simulator
- Shadow of the Tomb Raider
- Total War Saga: Troy
- Overall gaming performance
- Gaming performance per euro
- PCMark and Geekbench
- Web performance
- 3D rendering: Cinebench, Blender, ...
- Video 1/2: Adobe Premiere Pro
- Video 2/2: DaVinci Resolve Studio
- Graphics effects: Adobe After Effects
- Video encoding
- Audio encoding
- Broadcasting (OBS and Xsplit)
- Photos 1/2: Adobe Photoshop and Lightroom
- Photos 2/2: Affinity Photo, Topaz Labs AI Apps, ZPS X, ...
- (De)compression
- (De)encryption
- Numerical computing
- Simulations
- Memory and cache tests
- Processor power draw curve
- Average processor power draw
- Performance per watt
- Achieved CPU clock speed
- CPU temperature
- Conclusion