One of the signs—or perhaps more a symbol—accompanying Intel’s decline in the processor space the company was an unchallenged leader of just a few years ago, was the removal of HT or Hyper‑Threading, a technology processing two threads on a single core that significantly boosted multithreaded performance. So much so that the new CEO promised a reintroduction. Intel has now confirmed this, providing an outlook on when it will happen. Read more “Intel CPUs To Get Hyper‑Threading Back in Two Years”
Tag: Xeon
Intel resumes investing in EU. Ireland will get a 3nm node Fab
Under Patrick Gelsinger, Intel planned to build its first semiconductor fab in continental Europe, in Magdeburg, Germany to expand the company’s manufacturing capacity and turn Intel into a foundry rivalling TSMC. The project was also intended to help develop semiconductor manufacturing within the EU. Intel’s financial difficulties and cutting costs was the end of the project, but it seems Europe investments are back on the table now. Read more “Intel resumes investing in EU. Ireland will get a 3nm node Fab”
Intel reverses course: Hyper-Threading returns to CPUs
We’ve already written about the painful measures Intel is implementing get out of the deep red numbers it sunk into due to maintaining and building its own chip fabs (because as a “fabless” player, Intel would be profitable). Among them, however, is one unexpected development: Intel processors are set to reintroduce Hyper-Threading technology for processing multiple threads simultaneously. And this is actually quite peculiar… Read more “Intel reverses course: Hyper-Threading returns to CPUs”
Intel plans its own 3D V-Cache, but not for gaming CPUs
AMD processors are now the performance leaders in games (people likely didn’t see this coming, back in the early Ryzen days), thanks in large part to 3D V-Cache technology boosting the L3 cache capacity to 96MB, which can hold a good part of game’s hot data. It makes sense to expect Intel to come up with something similar to catch up to AMD. After all, they once had something similar in the form of Broadwell processors with eDRAM. Read more “Intel plans its own 3D V-Cache, but not for gaming CPUs”
Next-gen Xeon 6 has 128 Meteor Lake P-Cores and 500W TDP
We recently mused that Intel could catch up, if not overtake AMD in iGPU performance, but now there’s information suggesting upcoming Intel Xeon processors could close the gap with AMD in servers. In fact, the “Granite Rapids” processors appear to eliminate AMD Epyc processors’ long-standing lead in core count and will bring as many as 128 cores. However, these will probably use the not-so-successful Meteor Lake microarchitecture… Read more “Next-gen Xeon 6 has 128 Meteor Lake P-Cores and 500W TDP”
Intel launches new Emerald Rapids Xeon CPUs with fast cadence
Last week, Intel released 4nm Meteor Lake processors with long-awaited chiplet architecture. At the same time, Intel is also releasing the second generation of chiplet Xeons called “Emerald Rapids”. It follows very quickly after the previous “Sapphire Rapids” and, along with various improvements and fixes, it curiously walks back on chiplets a bit, as it uses only two instead of four. This has not only reduced costs but also power draw. Read more “Intel launches new Emerald Rapids Xeon CPUs with fast cadence”
AMD Zen 6 requiring new socket? Server roadmap may suggest so
Last week, a roadmap (or rather a cutout of it) apparently coming from one of the manufacturers of servers and similar hardware that was showing the planned products of the major players – Intel, AMD and Nvidia – was made public on the internet by leaker YuuKi_AnS. It appears to be showing the plans for 2025 or 2026, so time still quite a bit far off and product generations following those that are to come to market now. Read more “AMD Zen 6 requiring new socket? Server roadmap may suggest so”
W790 board for Sapphire Rapids: 64L and 112L CPUs both supported
One of December’s interesting news was the leak about Intel’s new Sapphire Rapids CPU platform for both high-end desktop (HEDT) and workstations. It’s three CPU platforms – but besides the 2S systems, we’re mainly interested in the two lineups for single-processor workstations: the pricier octo-channel Xeon W-3400 and the cheaper quad-channel Xeon W-2400 with fewer cores. But it looks like these two will be partially compatible. Read more “W790 board for Sapphire Rapids: 64L and 112L CPUs both supported”
Return of Intel’s HEDT: W790, Xeon W-2400 and W-3400 processors
Yesterday, we discussed Intel’s leaked roadmap for 2023, specifically the plans for desktop segment. But in addition to the mainstream LGA 1700 socket, this roadmap also shows new workstation platforms. Alongside the most expensive server-derived platforms, it reveals the W790 platform that should be a more affordable option representing a successor to older HEDT products like the X299 platform, and is therefore of much interest to us. Read more “Return of Intel’s HEDT: W790, Xeon W-2400 and W-3400 processors”
Intel’s preparing a 38-core Ice Lake for workstations/desktop
Intel has finally released desktop processors with a new architecture (Rocket Lake), which is also used in 10nm laptop and server CPUs. But high-end desktop has been forgotten and is still server by the old Skylake. But a roadmap leak now shows that Intel is planning something new: 10nm Xeon W-3300 with 38 Ice Lake cores for workstations. They should even be released pretty soon, which is what the roadmap also says about desktop Alder Lake. Read more “Intel’s preparing a 38-core Ice Lake for workstations/desktop”
Intel Sapphire Rapids leaked: huge chiplet CPU with an FPGA
We are currently waiting for Intel’s new desktop processors (Rocket Lake, later Alder Lake), but it looks like the company is planning much bigger changes for servers. A sample of a Sapphire Rapids server processor and possibly high-end desktop surfaced on the web and it looks very interesting: it is composed of chiplets, some versions should have HBM2 memory inside and a small FPGA has even been found under the IHS. Read more “Intel Sapphire Rapids leaked: huge chiplet CPU with an FPGA”
New challenge: OC of Xeon on a Asus board with 2× LGA 3647
This summer, Intel and AMD introduced processors with significantly higher power consumption and heat output: Threadripper with 180W TDP and Skylake-X that does not fall behind. After OC, both can consume over 300W (and Core i9-7980XE even more). These are new challenges for cooling, but maybe they are not the final “boss”. It looks like OC possibilities will now open for the latest generation of Xeon servers with 28 cores. Read more “New challenge: OC of Xeon on a Asus board with 2× LGA 3647”








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